Ultra 3SP HD

Video Case Studies Quote

EnvisionTEC’s ULTRA 3SP Series 3D printers use ground-breaking 3SP (Scan, Spin and Selectively Photocure) technology to quickly 3D print highly accurate parts from STL files regardless of the geometric complexity. The ULTRA 3SP HD is delivered and installed with all the relevant software to enable automatic generation of supports and perfect model production. The surface quality of the printed models show no signs of stairstepping on the inner and outer surfaces. The reliability of the imaging light source and the high-speed productivity makes it the most competitive 3D printer on the market today.

Machine Properties

Build Envelope

266 x 175 x 193 mm (10.5 x 6.9 x 7.6 in.)

XY Resolution*

50 µm (0.002 in.)

Dynamic Voxel Resolution in Z (Material Dependent)

50 – 100 µm (0.002 – 0.004 in.)

Data Handling

STL

Warranty

1 year included

System Properties
  • A single material is used for both build and support
  • Easily removable, partially cured perforated supports
  • Very few moving parts make the system user-serviceable
  • Office friendly plug-and-play operation with a built-in touch screen
  • Extremely reliable system utilizing 3SP (Scan, Spin, and Selectively Photocure) technology
  • Low part cost due to minimal material waste
  • Produce everything from concept models to functional parts
  • Layerless technology with no stair stepping on inner and outer surfaces
  • Quiet operation
  • Footprint (L x W x H): 74 x 76 x 117 cm (29 x 30 x 46 in.)
  • Optional Stand (L x W x H): 74 x 76 x 64 cm (29 x 30 x 25 in.)
  • Weight: 90 kg (198 lbs)

 

Materials Available

Snap-fit items that require some elasticity

Prototype and end-use model printing

Applications

Related Printers:

Xede 3SP

Xede 3SP是EnvisionTEC最大的3SP打印机,可打印卓越品质的原型和生产件,打印尺寸可达95,045立方厘米(5800 立方英寸),分辨率为100微米(0.004英寸)。

Build Envelope

457 x 457 x 457 mm (18 x 18 x 18 in.)

XY Resolution*

100 µm (0.004 in.)

Xtreme Hi-Res 3SP

Xtreme 3SP Hi-Res是要求大打印尺寸和更高分辨率50微米(0.002英寸)应用的理想解决方案。从原型到生产件,Xtreme 3SP Hi-Res都可提供卓越的表面光洁度和精细度。

Build Envelope

254 x 362 x 356 mm (10 x 14.25 x 14 in.)

XY Resolution*

100 µm (0.004 in.)

Primary Markets

Xtreme 3SP

Xtreme 3SP具有打印尺寸大和高速的特点,是汽车和航空服务机构或原始设备制造商的理想选择。分辨率为100微米(0.004英寸),可提供卓越的表面光洁度,打印尺寸可达29,497立方厘米(1800立方英寸)。

Build Envelope

254 x 362 x 330 mm (10 x 14.25 x 13 in.)

XY Resolution*

100 µm (0.004 in.)

Vector 3SP

Vector 3SP可提供卓越的表面光洁度和速度,打印尺寸可达30,316立方厘米(1850立方英寸),可打印从概念模型到功能件的任何物体,分辨率为100微米(0.004英寸)。

Build Envelope

300 x 200 x 275 mm (11.8 x 7.9 x 10.8 in.)

XY Resolution*

100 µm (0.004 in.)

Ultra 3SP

ULTRA 3SP完美适用于各种消费品与汽车应用,分辨率为100微米(0.004英寸),打印尺寸可达9013立方厘米(550立方英寸)。

Build Envelope

266 x 175 x 193 mm (10.5 x 6.9 x 7.6 in.)

XY Resolution*

100 µm (0.004 in.)

Materials Available for the Ultra 3SP HD Printer

EnvisionTEC‘s ABS Flex White 是一种具有极高柔性的类ABS 3D打印材料,适用于技术。ABS Flex White应用范围广泛,包括要求一定弹性的卡扣件和装配应用。

ABS Hi-Impact 3SPE-Model 3SP是一种韧性材料,适用于打印汽车和日用消费品等类型产品零件的高品质原型,也适用于生产级质量的成品件。