Xede 3SP

Video Case Studies Quote

EnvisionTEC’s Xede 3SP large format 3D printer allows for the production of exceptionally large 3D parts, built at fast build speeds without sacrificing surface quality and part accuracy. The Xede 3SP uses EnvisionTEC’s 3SP (Scan, Spin, and Selectively Photocure) technology to quickly 3D print highly accurate parts from STL files regardless of geometric complexity. Each 3D printer is delivered and installed with all the relevant software to enable automatic generation of supports and perfect model production. The surface quality of the printed models show no signs of stairstepping on the inner and outer surfaces. The reliability of the light source and the high speed productivity of the Xede 3SP makes it one of the most competitive 3D printers on the market today.

Machine Properties

Build Envelope

457 x 457 x 457 mm (18 x 18 x 18 in.)

XY Resolution*

100 µm (0.004 in.)

Accuracy

+/-150 µm (+/-0.006 in.)

Dynamic Voxel Resolution in Z (Material Dependent)

50 – 100 µm (0.002 – 0.004 in.)

Data Handling

STL

Warranty

1 year included

System Properties
  • A single material is used for both build and easily removable, partially cured perforated supports
  • Very few moving parts make the system user-serviceable
  • Low part cost due to minimal material waste
  • Produce everything from concept models to functional parts
  • Connect directly to a PC workstation or be integrated into a network for pre-processing of the job files and for remote monitoring
  • The stand-alone PC allows for working independently from pre-processing workstation
  • Footprint (L x W x H): 168 x 142 x 165 cm (66 x 56 x 65 in.)
  • Weight: 565 kg (1245 lbs)

 

Materials Available

Prototype and end-use model printing

Applications

Related Printers:

Xtreme Hi-Res 3SP

Xtreme 3SP Hi-Res是要求大打印尺寸和更高分辨率50微米(0.002英寸)应用的理想解决方案。从原型到生产件,Xtreme 3SP Hi-Res都可提供卓越的表面光洁度和精细度。

Build Envelope

254 x 362 x 356 mm (10 x 14.25 x 14 in.)

XY Resolution*

100 µm (0.004 in.)

Primary Markets

Xtreme 3SP

Xtreme 3SP具有打印尺寸大和高速的特点,是汽车和航空服务机构或原始设备制造商的理想选择。分辨率为100微米(0.004英寸),可提供卓越的表面光洁度,打印尺寸可达29,497立方厘米(1800立方英寸)。

Build Envelope

254 x 362 x 330 mm (10 x 14.25 x 13 in.)

XY Resolution*

100 µm (0.004 in.)

Vector Hi-Res 3SP

Vector Hi-Res 3SP可打印尺寸达30,316立方厘米(1850立方英寸),分辨率为50.8微米(0.002英寸)的大型零件。具有光滑表面光洁度的高精细零件使Vector Hi-Res 3SP成为各种不同应用的理想选择。

Build Envelope

300 x 175 x 275 mm (11.8 x 6.9 x 10.8 in.)

XY Resolution*

50.8 µm (0.002 in.)

Vector 3SP

Vector 3SP可提供卓越的表面光洁度和速度,打印尺寸可达30,316立方厘米(1850立方英寸),可打印从概念模型到功能件的任何物体,分辨率为100微米(0.004英寸)。

Build Envelope

300 x 200 x 275 mm (11.8 x 7.9 x 10.8 in.)

XY Resolution*

100 µm (0.004 in.)

Ultra 3SP HD

ULTRA 3SP HD可提供与原始ULTRA 3SP相同的卓越的表面光洁度和速度,但另外还具有超高的50微米(0.002英寸) 分辨率。

Build Envelope

266 x 175 x 193 mm (10.5 x 6.9 x 7.6 in.)

XY Resolution*

50 µm (0.002 in.)

Ultra 3SP

ULTRA 3SP完美适用于各种消费品与汽车应用,分辨率为100微米(0.004英寸),打印尺寸可达9013立方厘米(550立方英寸)。

Build Envelope

266 x 175 x 193 mm (10.5 x 6.9 x 7.6 in.)

XY Resolution*

100 µm (0.004 in.)

Materials Available for the Xede 3SP Printer

ABS Hi-Impact 3SPE-Model 3SP是一种韧性材料,适用于打印汽车和日用消费品等类型产品零件的高品质原型,也适用于生产级质量的成品件。

This advanced, engineering-grade material delivers large castable patterns and functional prototypes with best-in-class accuracy and surface finish. FormCast is formulated for use on EnvisionTEC's 3SP family of printers.